The MIPIAlliance, an international organization that develops interface specifications for mobile and connected-device industries, has announced its 270 member companies now have early access to MIPI I3C, a forthcoming sensor interface specification that allows for the development and advancement of innovative designs in the mobile, Internet of Things (IoT) and automotive markets.
The proliferation of sensors calls for a core sensor integration technology solution like MIPI I3C that gives developers unprecedented potential to design new products, said Joel Huloux, Chairman of the Board of MIPI Alliance. We expect MIPI I3Cs integration benefits will find broad market acceptance and help companies cost effectively meet the increasing demand for sensor-enriched products.
The number of connected intelligent devices will reach an installed base of 36 billion units by 2020, representing a significant increase in the total sensor market, said Richard Wawrzyniak, principal analyst, ASIC & SoC, Semico Research Corp. The growth in connected devices and the abundance of sensors in these devices will benefit from a unified, easy-to-use sensor interface such as MIPI I3C.
MIPI I3C solves the engineering communitys pressing need for a convenient chip-to-chip interface that alleviates the challenges of integrating sensors in product designs.
MIPI Alliance members can download MIPI I3C to review and begin developing designs based on the specification. To encourage early adoption of the specification in the sensor and device manufacturing ecosystems, MIPI Alliance invites new members to join the organization with prorated membership fees through December 2016.
MIPI I3C is groundbreaking because it incorporates and advances the available I2C, SPI and UART interfaces into a consolidated specification, and at the same time provides backwards compatibility with most types of I2C devices. The new approach makes it easier for both device manufacturers and software developers to add more sensors to devices and combine multiple sensors from different vendors in products while reducing component and implementation costs. The specification also improves performance and power efficiency and provides sensor management capabilities not previously available.
MIPI I3C was developed with tremendous collaboration and dedication from companies across the mobile, sensor and other industries who share common goals for innovation, said Ken Foust, chair of the MIPI Alliance Sensor Working Group. The contributions of so many stakeholders underscore the interest, need and demand in the marketplace for a new solution. On behalf of MIPI Alliance, Id like to thank everyone who participated in this important work.