The MIPIAlliancehas announced a new milestone in the organizations growth and development: Its membership now numbers 300 companies representing semiconductor, device manufacturers and other innovators in mobile, IoT, automotive and other industries.
“MIPI Alliance has grown year-over-year since its inception and the 300-member mark is particularly meaningful because it reflects increased adoption of MIPI specifications, broadened geographic reach of the organization and the extended application of our specifications to new markets and ecosystems,” said Joel Huloux, chairman of MIPI Alliance. “We thank all of our members for their commitment and look forward to continuing our dedicated work to serve our members in the years ahead.”
MIPI Alliance was formed in 2003. Its initial charter was to provide specifications for the intricate wiring that interconnects cameras and other multimedia components in mobile devices, with the vision of spurring innovation in the smartphone industry and helping companies accelerate time-to-market with their designs. The impact of that vision is well established, and today every smartphone uses at least one MIPI specification. As MIPI Alliance approaches its 15-year anniversary in 2018, it is highlighting the breadth of its specificationswhich simplify the integration of components in mobile devicesand the steadily increasing adoption of its specifications for use in more sectors.
The milestones include:
- Its industry-leading role enabling the wires behind wireless. MIPI Alliances specifications are universally used to interconnect RF-components, processors, cameras and displays in a device. The most widely adopted specifications include MIPI CSI-2, MIPI DSI, MIPI RFFEand MIPI physical layers: MIPI C-PHY,MIPI D-PHY, and MIPI M-PHY.
- A dedicated membership that has strategically advanced MIPI specifications for use in new areas. Companies are applying MIPI specifications for sensor interconnections and to interface components in IoT devices, imaging technologies, automotive systems, augmented reality/virtual reality (AR/VR) devices and more. New specifications include MIPI I3C, an updated version of MIPI CSI-2(v2.0) and the forthcoming MIPI CCS v1.0 (camera command set) that is slated for release in late 2017.
- Outreach to global developers. MIPI Alliance has recently begun offering its MIPI DevCon developers conferences globally. It is hosting two events in Asia this year for its international membership.
“MIPI Alliance specifications are widely used throughoutthe mobile industry, making it moreconvenientfor manufacturers to combine new components and createpowerful, feature-rich smartphones,” said Linley Gwennap, principal analyst of The Linley Group. “Building on this success in mobile, MIPI specifications are now appearing in automotive,IoT, and drones, bringing similar benefits to these emerging applications.”